Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

 
: Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F.

:

Institute of Electrical and Electronics Engineers -IEEE-:
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 : 7-9 April 2014, Ghent , Belgium
Piscataway, NJ: IEEE, 2014
ISBN: 978-1-4799-4791-1 (Print)
ISBN: 978-1-4799-4790-4
pp.425-428
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
This paper describes a method used for experimental real-time monitoring of thermo-mechanical stress build-up during integrated circuit encapsulation. To detect the stress variations during molding, special stress measuring chips were employed. The working principle of the stress chip is based on the piezoresistive sensors embedded on the surface in a 6 by 6 matrix distribution. [1]

: http://publica.fraunhofer.de/documents/N-301381.html