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Broadband interconnect design for silicon-based system-in-package applications up to 170 GHz

: Topak, E.; Choi, J.-Y.; Merkle, T.; Koch, S.; Saito, S.; Landesberger, C.; Faul, R.; Bock, K.

European Microwave Association:
43rd European Microwave Conference, EuMC 2013. Proceedings : 6.-11. Oktober, 2013, Nürnberg, European Microwave Week, EuMW
Louvain-la-Neuve: European Microwave Assiciation, 2013
ISBN: 978-2-87487-031-6
European Microwave Conference (EuMC) <43, 2013, Nuremberg>
European Microwave Week (EuMW) <16, 2013, Nuremberg>
Conference Paper
Fraunhofer EMFT ()

This paper presents the design of vertical chip-to-chip interconnects for mm-wave system-in-package (SiP) applications up to 170 GHz. Solid and liquid type polymer materials are used as the interlayer dielectric on the structured Si-wafers to realize coplanar waveguide (CPW) interconnects. Coplanar transmission lines fabricated on high- and low-resistivity silicon substrates are tested and their characteristics are compared, as well. The interconnect structures show excellent electrical performance from DC up to 170 GHz with an insertion loss of 0.6 dB per transition at 170 GHz.