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Inverse laser drilling of transparent materials for the production of optical components

: Werner, M.; Esser, D.; Hoffmann, H.-D.


Institute of Electrical and Electronics Engineers -IEEE-:
Conference on Lasers and Electro-Optics Europe & International Quantum Electronics Conference, CLEO®/Europe-IQEC 2013 : 12-16 May 2013, Munich, Germany
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-0593-5 (Print)
ISBN: 978-1-4799-0594-2
1 pp.
Conference on Lasers and Electro-Optics (CLEO Europe) <2013, Munich>
International Quantum Electronics Conference (IQEC) <2013, Munich>
Conference Paper
Fraunhofer ILT ()

Glass components with complex structures are required for many industrial applications. Conventional drilling procedures are based on classical drilling methods on the basis of abrasives or ultrasonic drilling. Photonic fiber preforms are produced by means of the Stack and Draw technique [1]. The Inverse Laser Drilling (ILT patent DE 100 29 110 B4) allows for fully automated processing of 3D structures in transparent glass materials.