English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Multi-scale materials data for 3D TSV stack performance simulation and model validation
Details
Full
Export
Statistics
Options
2013
Conference Paper
Titel
Multi-scale materials data for 3D TSV stack performance simulation and model validation
Author(s)
Zschech, E.
Yeap, K.B.
Sander, C.
Muehle, U.
Gall, M.
Sukharev, V.
Hauptwerk
9th International Conference and Exhibition on Device Packaging, DPC 2013
Konferenz
International Conference and Exhibition on Device Packaging 2013
Language
English
google-scholar
View Details
IZFP-D