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Process dynamics of high power pulsed magnetron sputtering for large area coating

: Krause, U.; List, M.; Mecke, H.; Sommer, S.

Vitkala, J.:
Glass Processing Days, 7th International Conference on Architectural and Automotive Glass 2001. Conference Proceedings : 18 to 21 june 2001, Tampere, Finland
Tampere, 2001
ISBN: 952-91-3526-2
International Conference on Architectural and Automotive Glass <7, 2001, Tampere>
Glass Processing Days Conference (GPD) <2001, Tampere>
Conference Paper
Fraunhofer FEP ()

For the deposition of dielectric thin films Pulsed Magnetron Sputtering (PMS) has become a relevant factor for industrial applications in large area coating of architectural glass. Combination of pulsed power supply and Dual Magnetron Sputtering (DMS) system enables the deposition of insulating layers AL2O3, SiO2, ZnO and SnO2 with high rates.Pulsed Magnetron Sputtering process in conjunction with high power density requires intelligent process management. An process control using a combinationof several process parameters were used. In conjunction with process stability the reaction of the power supply had to adjust in order to react to all kinds of arcs. The interactions between process regulation and dynamics of power supply are described by means of the deposition of zunc oxide.For coating oxides the lambda probe is a sophosticated tool for characterization the discharge conditions and process stability. The result of optimization of the sputtering system is a long term stable deposition process.