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3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding

 
: Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Geßner, T.

Advanced Metallization Conference 2013 : 30th Edition, Albany, New York, USA, 21 - 23 October 2013
Red Hook, NY: Curran, 2013
ISBN: 978-1-62993-825-7
pp.83-95
Advanced Metallization Conference (AMC) <30, 2013, Albany/NY>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-300740.html