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Market drivers and architectural requirements for backplane inter-connect capacities in next generation PON head-end equipment in the access network

 
: Dorward, R.M.; Symington, K.; Brusberg, L.; Kropp, J.-R.; Miller, A.; Pitwon, R.; Whalley, S.

:

Jaworski, M. ; Institute of Electrical and Electronics Engineers -IEEE-; IEEE Photonics Society:
15th International Conference on Transparent Optical Networks, ICTON 2013 : Cartagena, Spain, 23 - 27 June 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-0682-6
ISBN: 978-1-4799-0684-0
ISBN: 978-1-4799-0683-3
International Conference on Transparent Optical Networks (ICTON) <15, 2013, Cartagena>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper examines the market drivers and architectural requirements for the evolution of Access Network PON 'Head-End' equipment in the FP7 PIANO+ timescales and the implications for the internal backplane interconnect capacities within such equipment. It then outlines the solutions proposed within the SEPIANet project to achieve these capacities and gives an interim view of the project achievements.

: http://publica.fraunhofer.de/documents/N-300607.html