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Applying a physics-based via model for the simulation of Through Silicon Vias

 
: Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Microwave Theory and Techniques Society; IEEE Components, Packaging, and Manufacturing Technology Society:
22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 : San Jose, California, USA, 27 - 30 October 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-0705-2 (print)
ISBN: 978-1-4799-0707-6
ISBN: 978-1-4799-0708-3
pp.65-68
Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) <22, 2013, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper presents a first approach for the efficient modeling of Through Silicon Vias based on a Physics-Based Via model for application in silicon interposers with metallic boundaries.

: http://publica.fraunhofer.de/documents/N-300582.html