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Development of embedded high power electronics modules for automotive applications

 
: Böttcher, L.

International Microelectronics and Packaging Society -IMAPS-:
9th International Conference and Exhibition on Device Packaging, DPC 2013 : Scottsdale/Fountain Hills, Arizona, USA, 11-14 March 2013
Red Hook, NY: Curran, 2013
ISBN: 978-1-62748-774-0
pp.886-899
International Conference and Exhibition on Device Packaging <9, 2013, Scottsdale/Ariz.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-300532.html