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Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate

: Bargiel, S.; Baranski, M.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.

DOI: 10.1109/Transducers.2013.6626821

	Institute of Electrical and Electronics Engineers -IEEE-: Transducers 2013, 17th International Conference on Solid-State Sensors, Actuators and Microsystems : Eurosensors XXVII; Barcelona, Catalonia (Spain); 16 - 20 June 2013 Piscataway, NJ: IEEE, 2013 ISBN: 978-1-4673-5981-8 ISBN: 978-1-4673-5983-2 pp.534-537
	International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) <17, 2013, Barcelona> European Conference on Solid-State Transducers (Eurosensors) <27, 2013, Barcelona>

	English
	Conference Paper
	Fraunhofer ENAS ()

Abstract
This work presents the development of an integrated micro-optical beam splitter that can be arranged in array, and based on saw-dicing of glass substrates. The latter allows a rapid and rather low-cost processing, and in addition leads to high compactness and possibility of wafer level alignments, suitable for vertically integrated imaging microinstruments. The device allowing additional out-of plane reflection for extraction of sensing beam can be as small as 1mm3.

: http://publica.fraunhofer.de/documents/N-300489.html