Disc-shaped magazine for mounting disc-shaped object e.g. semiconductor silicon wafer, has stacking area delimiting boundary structure that inlcudes leaf spring damping elements which are secured to spring at fixed end
Date Issued
2012
Author(s)
Giesen, Tim
Fischmann, Christian
Ehm, Alexander
Patent No
102011013511
Abstract
The magazine has a base (1), and stacking area delimiting boundary structures (18) that are arranged in perpendicualr to base surface (14). The stacking area delimiting boundary structure inlcudes leaf spring damping elements (17) which are secured to spring at fixed end. The damping elements are equipped with bristles (5). An independent claim is included for device for mounting disc-shaped object.