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Grinding of monocrystalline diamond

 
: Brecher, C.; Sobotka, A.; Wenzel, C.

Blunt, L. ; European Society for Precision Engineering and Nanotechnology -EUSPEN-:
Laser metrology and machine performance X : 10th International Conference and Exhibition on Laser Metrology, Machine Tool, CMM & Robotic Performance, Lamdamap 2013. 20 - 21 March 2013, Chicheley Hall, Newport Pagnell, Bucks, Buckinghamshire, UK
Cranfield: Euspen, 2013
ISBN: 978-0-9566790-1-7
pp.299-308
International Conference and Exhibition on Laser Metrology, Coordinate Measuring Machine and Machine Tool Performance (LAMDAMAP) <10, 2013, Newport Pagnell>
English
Conference Paper
Fraunhofer IPT ()

Abstract
Within this paper a newly developed diamond grinding machine for monocrystalline diamond tools has been presented. Due to the fact that this machine is a prototype, the properties of the machine and the grinding process on this particular machine have to be investigated. Therefore, a systematic approach was chosen to conduct the grinding tests. Based on the first test series, which was used to determine the significant influence parameters on the grinding results, it was shown that a process with a fixed C-axis results in a better surface roughness. Furthermore, it has been determined that the different removal rates on the crystallographic planes have an influence on the surface roughness as well.

: http://publica.fraunhofer.de/documents/N-290938.html