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AFM based methods for mechanical characterization of Nanothin films in electronics

: Kopycinska-Müller, Malgorzata; Striegler, André; Kuzeyeva, Nataliya; Köhler, Bernd; Wolter, Klaus-Jürgen


Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section, Reliability CPMT EDS Chapter; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 : Singapore, 11 - 13 December 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-2833-0
ISBN: 978-1-4799-2835-4
ISBN: 978-1-4799-2834-7
ISBN: 978-1-4799-2832-3
Electronics Packaging Technology Conference (EPTC) <15, 2013, Singapore>
Conference Paper
Fraunhofer IKTS ()
Atomic Force Acoustic Microscopy; lateral resolution; local indentation; mechanical characterizations; nano scale

We have developed a methodology to determine local indentation modulus M for films with thickness ranging from several nanometers to several hundreds of nanometers with nano-scale lateral resolution. Our results obtained for silicon oxide as well as porous organosilicate glasses were in a very good agreement with those provided by nanoindentation methods. The method used is the so-called atomic force acoustic microscopy (AFAM).