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Wafer bonding technologies for 3D integration
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2014
Conference Paper
Titel
Wafer bonding technologies for 3D integration
Author(s)
Baum, Mario
Hofmann, Christian
Besser, J.
Vogel, Klaus
Wiemer, Maik
Geßner, Thomas
Hauptwerk
Smart Systems Integration 2014
Konferenz
Smart Systems Integration Conference (SSI) 2014
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2014
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS