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Wafer bonding technologies for 3D integration

 
: Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.

Gessner, T.:
Smart Systems Integration 2014 : Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Aachen: Apprimus-Verlag, 2014
ISBN: 978-3-86359-201-1
pp.45-51
Smart Systems Integration Conference (SSI) <2014, Vienna>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <8, 2014, Vienna>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-287028.html