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Gripping-in-liquid: Handling challenges for automated ultra-thin wafer production

: Giesen, Tim; Mayer, Pablo; Stiels, Daniel; Wertz, Roland; Martini, Roberto; Debucquoy, Maarten; Verl, Alexander


Mine, A. ; European Commission:
28th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2013. Proceedings. DVD-ROM : 30 September to 04 October 2013, Paris, France
München: WIP-Renewable Energies, 2013
ISBN: 3-936338-33-7
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <28, 2013, Paris>
European Commission EC
Conference Paper
Fraunhofer IPA ()
Greifer; gripper; handling; Liquid Handling; Photovoltaik; wafer; SUGAR; Handhaben; Automatisierung; silicium

New approaches for future photovoltaic cell concepts issue a challenge to crystalline wafer handling. Especially concepts based on ultra-thin silicon wafers force automation developers to look even beyond the aims of the international PV manufacturing roadmap. As widely known, crystalline photovoltaic wafers are a very sensitive object for industrial production, especially for gripper-based handling solutions. The known wafering method "SLliM-cut" requires an additional cleaning step after a single wafer was detached from the parent substrate. To clean organic residues off substrates an etching bath is applied. In general, the investigation takes a look on the potential threads for thin foils such as cleaning a particle contamination off the substrate's surface. The paper further discusses the opportunities and limits for the automated handling of ultra-thin objects in cleaning baths and presents an approach for a high-volume process control. The tested gripping principles and processing parameters for underwater gripping of ultra-thin wafers and the opportunities for withdrawing the ultra-thin wafers out of a liquid are presented.