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Thick film pastes for nitride ceramics for high power applications

 
: Wenzel, Marco; Schmidt, Richard; Partsch, Uwe; Eberstein, Markus

International Microelectronics Assembly and Packaging Society -IMAPS-:
46th International Symposium on Microelectronics, IMAPS 2013 : September 30 - October 3, 2013, Orlando, Florida
Reston, Va.: IMAPS, 2013
ISBN: 978-1-62993-824-0 (Curran-Ausgabe)
pp.689-694
International Symposium on Microelectronics (IMAPS) <46, 2013, Orlando/Fla.>
English
Conference Paper
Fraunhofer IKTS ()
thick film pastes; AlN; Si3N4; resistor; high power

: http://publica.fraunhofer.de/documents/N-283395.html