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Power modules with embedded components

 
: Ostmann, Andreas; Boettcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Lang, Klaus-Dieter

Institute of Electrical and Electronics Engineers -IEEE-:
European Microelectronics and Packaging Conference, EMPC 2013 : 9-12 September 2013, Grenoble, France
Piscataway, NJ: IEEE, 2013
ISBN: 978-2-95-274671-7
4 pp.
European Microelectronics and Packaging Conference (EMPC) <2013, Grenoble>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Power electronics for automotive applications has strong demands regarding reliability and cost. Especially the upcoming hybrid cars and fully electrical vehicles need compact and efficient power modules. Within engine compartments the installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally components like IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics and their top contacts are connected by thick Al wires. These ceramic modules are soldered to water-cooled base plates. Embedding of power switches and controller into compact modules using PCB (Printed Circuit Board) technologies offers the potential to further improve the thermal management by double-sided cooling and to reduce the thickness of the module. In order to replace DCB ceramics a structure of thermal laminate material between thick Cu layers has been developed and the capability for thermal conduction and electrical insulation has been evaluated. For the assembly of large power IGBTs of more than 100 mm² size new silver sintering pastes have been evaluated. They enable a low-pressure sintering at temperatures below 200 °C, compatible to PCB materials. To handle switching currents over 100 A, suitable copper tracks in the PCB are required. The realization of such thick copper lines up to 1 mm thickness requires advanced processing, compared to conventional multilayer PCB production. In order to form complex power systems out of modules with embedded chips interconnections by Ag sintering are under development. In this paper the development of a 10 kW inverter module with embedded components will be described. Process steps and reliability investigations of the different interconnect levels will be described in detail.

: http://publica.fraunhofer.de/documents/N-282041.html