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Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik

Connecting microelectronic components mechanically or electrically, places inter-reactive materials between them and initiates reaction to bond them together.
 
: Manke, I.; Becker, K.; Ostmann, A.; Reichl, H.

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Frontpage ()

DE 2003-10334391 A: 20030728
DE 2003-10334391 A: 20030728
WO 2004-EP8206 A: 20040722
DE 10334391 A1: 20050303
H01R0043
B23K0020
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
Bei einem Verfahren zum Erstellen einer mechanischen und/oder elektrischen Verbindung zwischen einer ersten Komponente und einer zweiten Komponente wird zunaechst ein reaktives Material zwischen der ersten Komponente und der zweiten Komponente angeordnet. Dabei wird das reaktive Material derart angeordnet, dass es benachbart zu der ersten Komponente und der zweiten Komponente ist. Anschliessend wird eine exotherme Reaktion des reaktiven Materials ausgeloest.

 

WO2005011908 A UPAB: 20050303 NOVELTY - A first reactive material (120, 220) is placed adjacently between the first and second components. A second reactive material (260) is located between the reactive material (220) and at least one of the components (200, 202). An exothermic reaction (150, 250, 276) is started between the first and second materials, causing bonding of the components. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the corresponding bonding method. USE - To connect microelectronic components mechanically and/or electrically. ADVANTAGE - This method releases energy for bonding, very locally. It also permits precise control over the quantity of energy released and the rate of reaction. Excessive heating of components to be bonded, is prevented. The method is economical; it is a simple matter to place precise quantities of reagents and/or solder on the components. Various options are available for bonding, for example a solder is melted by the reaction. The reagents may be in powder- or encapsulated form and reaction may be initiated by breaking the capsules open under mechanical pressure. One or more of: metals, metal oxides, polymers or biological materials may participate.

: http://publica.fraunhofer.de/documents/N-28195.html