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High-Resolution Radioscopy and Tomography for Light Materials and Devices

: Helfen, L.; Baumbach, T.; Banhart, J.; Stanzick, H.; Cloetens, P.; Ludwig, W.; Baruchel, J.

urn:nbn:de:0011-n-28199 (468 KByte PDF)
MD5 Fingerprint: 4340d8bb4945f1b2050c00f80bdea575
Created on: 12.04.2001

Italian Society for Nondestructive Testing:
15th World Conference on Nondestructive Testing 2000
Online im WWW, 2000
5 pp. : Ill.
World Conference on Non-Destructive Testing <15, 2000, Rom>
Conference Paper, Electronic Publication
Fraunhofer IZFP ()
micro-tomography; radiography; phase contrast; light material; composite; foam; fiber material; flip-chip; solder bump; metallization layer; hidden structure; wire bonding; glob top

New manufacturing techniques and innovative materials, nowadays used in modern product design and fabrication, require elaborated quality control methods by non-destructive testing (NDT). Prominent examples for the needs of high-performance characterization and quality control methods are advanced structured materials (e.g. composites, organic and metallic foams) and microelectronics (e.g. flip-chips, glob-tops). In many cases, the fine structure in those material categories demands the highest spatial resolution achievable. Especially in microelectronics, the recent and upcoming advances in miniaturization will impose the needs for progress in methods of non-destructive testing. The growing number of connections in electronic circuits and components will result in a poor yield if no innovative testing methods would be applied.