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Computer vision analysis of 3D scanned circuit boards for functional testing and redesign

: Grosser, Hendrik; Beckmann-Dobrev, Boris; Politz, Friedrich; Stark, Rainer

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Procedia CIRP 11 (2013), pp.229-233
ISSN: 2212-8271
International Through-life Engineering Services Conference (TESConf) <2, 2013, Cranfield>
Journal Article, Conference Paper, Electronic Publication
Fraunhofer IPK ()

Testing, repair and overhaul of long-living printed circuit boards (PCBs) is a laborious task if no schematics or layout plans are available. Existing Reverse Engineering (RE) methods are time-consuming, error-prone, and destructive and require reference samples which makes them not feasible for non-OEM users of electronic devices. The Fraunhofer Institute for Production Systems and Design Technology (IPK) in Berlin and the Technical University Berlin have defined a new process for automated and non-destructive schematic and layout reconstruction based on electrical and optical measuring techniques. Current results and innovative approaches using computer vision analysis for recognition of PCB structure aiming to build error-free net lists through a net list merging algorithm are depicted in this paper.