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Konferenzschrift
Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
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2013
Conference Paper
Titel
Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Author(s)
Wiemer, Maik
Wünsch, Dirk
Froemel, J.
Geßner, Thomas
Bargiel, S.
Baranski, M.
Passily, N.
Gorecki, C.
Hauptwerk
ISMOT 2013. 14th International Symposium in Microwave and Optical Technology. Proceedings
Konferenz
International Symposium on Microwave and Optical Technology (ISMOT) 2013
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS