English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
CMP process development and adaption for wafer bonding
Details
Full
Export
Statistics
Options
2011
Conference Paper
Titel
CMP process development and adaption for wafer bonding
Author(s)
Schubert, I.
Gottfried, Knut
Wünsch, Dirk
Baum, Mario
Martinka, Ronny
Hauptwerk
International Conference on Planarization/CMP Technology, ICPT 2011
Konferenz
International Conference on Planarization, CMP Technology (ICPT) 2011
Language
English
google-scholar
View Details
Fraunhofer-Institut für Elektronische Nanosysteme ENAS