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CMP process development and adaption for wafer bonding

 
: Schubert, I.; Gottfried, K.; Wuensch, D.; Baum, M.; Martinka, R.

International Conference on Planarization/CMP Technology, ICPT 2011 : November 9-11, 2011, Seoul
2011
pp.270-277
International Conference on Planarization, CMP Technology (ICPT) <2011, Seoul>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-279269.html