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Low temperature wafer bonding technology for RF based MEMS devices

 
: Haubold, M.; Figur, S.; Schoenlinner, B.; Kurth, S.; Gessner, T.

Gessner, Thomas (Ed.) ; Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2013. CD-ROM : Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3490-0
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-279261.html