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Reliability Investigations for High Temperature Interconnects
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2013
Conference Paper
Titel
Reliability Investigations for High Temperature Interconnects
Author(s)
Dudek, Rainer
Sommer, J.-P.
Fix, A.
Trodler, J.
Rzepka, Sven
Michel, Bernd
Hauptwerk
37th International Microelectronics and Packaging IMAPS-CPMT Poland Conference 2013. Proceedings. DVD
Konferenz
International Microelectronics and Packaging IMAPS-CPMT Poland Conference 2013
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS