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Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization

: Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S.


Institute of Electrical and Electronics Engineers -IEEE-:
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 : Berlin, Germany, 25 - 27 September 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-2271-0 (Print)
ISBN: 978-1-4799-2273-4 (online)
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <19, 2013, Berlin>
Conference Paper
Fraunhofer ENAS ()

This paper deals with the development und fabrication of a thermal test chip (TTC) to be used for thermal characterisation and qualification of materials and packages. The TTC is designed as a modular chip with the smallest full functional chip cell of 3.2mm × 3.2mm and consists of a heater structure and a temperature sensor. The chips can be applied in any required matrix. Heater and temperature sensors are realised by a 70 nm single Titanium layer as adhesion and barrier layer. The Titanium is structured a on 670μm silicon wafer by the cost efficient thin film technology. 3×3 matrix chips have been sawn, assembled on a FR4 substrate by flip chip technology and integrated into a test stand for characterisation of thermal interface materials (TIMA Tester). The calibration curves of the temperature sensors show 4-time higher sensitivity then Si diodes. The homogeneity of the surface temperature was checked by the Lock-In infra-red thermography and compared with a commercial thermo test chip.