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Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC

: Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society:
IEEE International Interconnect Technology Conference, IITC 2013. Proceedings : Kyoto, Japan, 13-15 June 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-0438-9
ISBN: 978-1-4799-0440-2
ISBN: 978-1-4799-0439-6
3 pp.
International Interconnect Technology Conference (IITC) <16, 2013, Kyoto>
Conference Paper
Fraunhofer ENAS ()

The paper presents a new stress measurement method on base of stress relief caused by local material removal with ion milling in FIB equipment. Stress relief deformations extracted from SEM micrographs by means of digital image correlation allow the determination of stresses, as well as to estimate Young's modulus on the position of ion milling. The paper gives an introduction into the method. The feasibility to extract local stresses in multilayer stacks, both in lateral direction and in depth, is discussed in more detail.