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Wafer level vacuum packaging of micro-mirrors with buried wiring

Poster presented at WaferBond 2013, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration; 5th- 6th December 2013, Stockholm, Sweden
 
: Langa, Sergiu; Drabe, Christian; Herrmann, Andreas; Ludewig, Thomas; Rieck, Andreas; Flemming, André; Kaden, Christiane

:
Poster urn:nbn:de:0011-n-2723868 (9.6 MByte PDF)
MD5 Fingerprint: 92410a821eecfdbff2b226fd79a161cc
Created on: 17.1.2014


2013, 1 pp.
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2013, Stockholm>
English
Poster, Electronic Publication
Fraunhofer IPMS ()

: http://publica.fraunhofer.de/documents/N-272386.html