Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Electronics in textiles – adhesive bonding technology for reliably embedding electronic modules into textile circuits

 
: Krshiwoblozki, Malte von; Linz, Torsten; Neudeck, Andreas; Kallmayer, Christine

:
Fulltext urn:nbn:de:0011-n-2722336 (6.4 MByte PDF)
MD5 Fingerprint: 90cd08864fea1ee233c279d4fcc5f435
Created on: 19.12.2013


Diamond, D.; Vincenzini, P.:
Wearable/wireless body sensor networks for healthcare applications : Selected, peer reviewed papers from CIMTEC 2012 - 4th International Conference on Smart Materials, Structures and Systems, June 10-14, 2012, Terme, Italy
Durnten-Zurich: Trans Tech, 2013 (Advances in science and technology 85)
ISBN: 3-908158-71-0
ISBN: 978-3-908158-71-4
ISBN: 978-3-908158-93-6 (e-Book)
pp.1-10
International Conference on Smart Materials, Structures, and Systems <4, 2012, Terme>
English
Conference Paper, Electronic Publication
Fraunhofer IZM ()
smart textiles; NCA-Bonding; thermoplastic adhesive bonding; electronic in textiles; textile integrated electronics; connecting insulated wires

Abstract
The interconnection of electronics and textile circuits is still a main challenge for the fabrication of reliable smart textiles. This paper investigates the thermoplastic adhesive bonding technology. Electronic modules are bonded to textile substrates with a thermoplastic nonconductive adhesive (NCA) film. The modules are placed onto textile circuits with an NCA-film inbetween. By applying pressure and heat, the adhesive melts and contact partners touch. Subsequently cooling solidifies the NCA resulting in an electrical and mechanical contact of the electronic module and the textile circuit. This paper shows the suitability of this technology for knitted, woven, non-woven and embroidered fabrics with metal coated yarns as well as with litzwires as conductors. Besides, it shows that the interconnection process works well with thermoplastically insulated conductors. In addition, the design of interposers has been improved in respect to contact formation and miniaturization compared to previous publications. The pitch of the contact pads is set to 1.27 mm. A textile display was realized with smart RGB-Pixels, which are controlled by an I²C-bus on a quadrupolic woven substrate. It demonstrates the applicability and the potential of this technology.

: http://publica.fraunhofer.de/documents/N-272233.html