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Miniaturized frequency doubled DPSS assembled using solderjet bumping technology
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2013
Conference Paper
Titel
Miniaturized frequency doubled DPSS assembled using solderjet bumping technology
Author(s)
Guilhot, Denis A.
Gilaberte, M.
Ferrando, Sara
Ribes, P.
Montes, D.
Galan, M.
Burkhardt, Thomas
Beckert, Erik
Hornaff, Marcel
Hauptwerk
Smart Systems Integration 2013. CD-ROM
Konferenz
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2013
Language
English
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Fraunhofer-Institut für Angewandte Optik und Feinmechanik IOF