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Wet chemical single-side emitter etch back for MWT solar cells with AL-BSF and challenges for via paste selection

: Spribille, A.; Lohmüller, E.; Thaidigsmann, B.; Hamid, R.; Nussbaumer, H.; Clement, F.; Preu, R.

Fulltext urn:nbn:de:0011-n-2669503 (335 KByte PDF)
MD5 Fingerprint: 525baf0b20c14cf52675f99dfd1ef4a0
Created on: 7.12.2013

Mine, A. ; European Commission:
28th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2013. Proceedings. DVD-ROM : 30 September to 04 October 2013, Paris, France
München: WIP-Renewable Energies, 2013
ISBN: 3-936338-33-7
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <28, 2013, Paris>
Conference Paper, Electronic Publication
Fraunhofer ISE ()
PV Produktionstechnologie und Qualitätssicherung; Silicium-Photovoltaik; Oberflächen: Konditionierung; Passivierung; Lichteinfang; Kontaktierung und Strukturierung; Herstellung und Analyse von hocheffizienten Solarzellen; Pilotherstellung von industrienahen Solarzellen; MWT-BSF; P-Type; Solar Cell; Metallisation

This work investigates the integration of a wet chemical single-side emitter etching process into the process sequence of screen printed p-type Czochralski-grown silicon MWT-BSF (metal wrap through aluminum back surface field) solar cells. The MWT-BSF solar cells fabricated with single-side emitter etch back achieve a median conversion efficiency of 18.4 % (as processed), while MWT-BSF solar cells isolated by laser grooves show a slightly lower median conversion efficiency of 18.2 % (as processed). Repeated current-voltage (I-V) measurements under forward and reverse bias using stabilized MWT-BSF solar cells with single-side emitter etch back confirm that a novel via paste enables stable results under forward bias (standard operation mode), although the via paste is in direct contact with the p-type base. MWT-BSF solar cells with single-side emitter etch back show increasing current densities under reverse bias without affecting the cell performance after repeated I-V measurements, this behaviour could be used for an integrated bypass approach. The results confirm the successful integration of single-side emitter etch back into the MWT-BSF process sequence allowing for the reduction of the process sequence by one process step compared to MWT-BSF solar cells isolated by laser grooves.