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Development of temperature-stable, solderable PVD rear metallization for industrial silicon solar cells

 
: Kumm, J.; Samadi, H.; Hartmann, P.; Nold, S.; Wolf, A.; Wolke, W.

:
Fulltext urn:nbn:de:0011-n-2669318 (299 KByte PDF)
MD5 Fingerprint: b59208de6154eb6fe7bd27ccdff80858
Created on: 29.11.2013


Mine, A. ; European Commission:
28th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2013. Proceedings. DVD-ROM : 30 September to 04 October 2013, Paris, France
München: WIP-Renewable Energies, 2013
ISBN: 3-936338-33-7
pp.1287-1290
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <28, 2013, Paris>
English
Conference Paper, Electronic Publication
Fraunhofer ISE ()
PV Produktionstechnologie und Qualitätssicherung; Silicium-Photovoltaik; Kontaktierung und Strukturierung; Pilotherstellung von industrienahen Solarzellen; Modulintegration; Produktionsanlagen und Prozessentwicklung; Solderabiltiy; PERC; Aluminium; Metallization; LFC

Abstract
In this work a solderable and temperature-stable rear metallization based on physical vapour deposition (PVD) is developed. A common Al metallization is complemented by a solder stack that consists of a sputter deposited TiN barrier layer and a thin solderable top layer, which are deposited on an industrial PVD machine in one process sequence. Peel-tests confirm sufficient adhesion for conventionally soldered cell interconnectors even when annealing at 425°C for 18 minutes before soldering, as well as stability of the solder joint during thermal aging at 130°C for 85 h. Our results suggest that our Al based PVD metallization scheme is industrially-feasible, compatible with a common soldering and interconnection process, potentially cost-efficient and therefore suitable for industrial PERC and other silicon solar cells.

: http://publica.fraunhofer.de/documents/N-266931.html