PublicaHier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
Development of temperature-stable, solderable PVD rear metallization for industrial silicon solar cells
In this work a solderable and temperature-stable rear metallization based on physical vapour deposition (PVD) is developed. A common Al metallization is complemented by a solder stack that consists of a sputter deposited TiN barrier layer and a thin solderable top layer, which are deposited on an industrial PVD machine in one process sequence. Peel-tests confirm sufficient adhesion for conventionally soldered cell interconnectors even when annealing at 425°C for 18 minutes before soldering, as well as stability of the solder joint during thermal aging at 130°C for 85 h. Our results suggest that our Al based PVD metallization scheme is industrially-feasible, compatible with a common soldering and interconnection process, potentially cost-efficient and therefore suitable for industrial PERC and other silicon solar cells.