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Test data for die attach lifetime modeling

Testdaten für die Lebensdauermodellierung von Halbleiteranbindungen
 
: Kraft, Silke

European Center for Power Electronics -ECPE-:
ECPE Workshop "Lifetime Modelling and Simulation" 2013 : 3 - 4 July 2013, Düsseldorf, Germany
Düsseldorf: ECPE, 2013
Kap. 17, 31 pp.
Workshop "Lifetime Modelling and Simulation" <2013, Düsseldorf>
English
Conference Paper
Fraunhofer IISB ()
test data; die attach; lifetime modeling; simulation

Abstract
The simple procedure of collecting test data for lifetime applications is challenging. Many possible sources of error, many different influences on the test. Combined different failure mechanisms that do or do not influence each other. Less experiences with failure mechanisms of new technologies in real life. Only a few parameters can be considered in lifetime modell, collectivity of influencing parameters too complex for one modell. There is still no perfect lifetime modell yet, development ongoing.

: http://publica.fraunhofer.de/documents/N-264981.html