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Generative Fertigungstechnologien für eine Direktintegration von mikroelektronischen Komponenten und Kontaktstrukturen

Generative production technologies for a direct integration of microelectronic components and contact structures
: Ifland, D.; Ansorge, F.; Baar, C.; Lang, K.-D.

Galvanotechnik 104 (2013), No.8, pp.1638-1643
ISSN: 0016-4232
Journal Article
Fraunhofer IZM ()

The present article deals with the development ofSys-tem-in-Package (SiP) modules, which are produced by stereolithography, an additive fabrication process. During the production process of the SIP module the necessary electrical components will be integrated into the carrier substrate. Afterwards the components will be interconnected of an electrically conductive adhesive. This method is intended to demonstrate a novel three-dimensional construction and connection technology for microsystems.