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2013
Conference Paper
Titel
Low cycle fatigue measurement results on real flip chip solder contacts
Abstract
The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen's displacements and the solder joint materials. The displacements varied between 2 m and 8 µm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5, SnAg3.0Cu0.75 and SnPb36. The strain rate was close to 1E-2 per second.