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Semi-insulating substrate based generic InP photonic integration platform

 
: Soares, F.M.; Janiak, K.; Kreissl, J.; Moehrle, M.; Grote, N.

:

Fédéli, J.-M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Integrated photonics: Materials, devices, and applications II : 24 - 26 April 2013, Grenoble, France
Bellingham, WA: SPIE, 2013 (Proceedings of SPIE 8767)
ISBN: 978-0-8194-9564-8
Paper 87670M
Conference "Integrated Photonics - Materials, Devices, and Applications" <2, 2013, Grenoble>
English
Conference Paper
Fraunhofer HHI ()

Abstract
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being undertaken to implement complex InP based application-specific photonic integrated circuits (ASPIC) with transmit and receive functionalities from a set of basic building blocks. The integration platform pursued at Fraunhofer HHI is building on semi-insulating substrate. Recently a variety of receiver-type PIC with up to 40 GHz bandwidth capability designed by external users was fabricated in multi-project wafer runs. Examples are demonstrated. Extension of this platform to include transmit functionalities is underway using an MOVPE based butt-coupling approach.

: http://publica.fraunhofer.de/documents/N-264461.html