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Modeling and minimizing the inductance of bond wire interconnects

 
: Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
17th IEEE Workshop on Signal and Power Integrity, SPI 2013 : 12-15 May 2013, Paris
New York, NY: IEEE, 2013
ISBN: 978-1-4673-5678-7 (Print)
ISBN: 978-1-4673-5679-4
4 pp.
Workshop on Signal and Power Integrity (SPI) <17, 2013, Paris>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in dependent on bonding parameters such as loop height, distance between bonding positions and the thickness of the metallization on which the wire is bonded, is derived for the first time. An excellent correlation is obtained between inductances extracted using our proposed model and those extracted using Ansys Q3D, with a maximum deviation of approximately 1%. Furthermore, methods for minimizing the inductance of bond wires, based on the definitions of loop and partial inductances are discussed. Test bond wire structures are designed, fabricated and measured to quantify the implemented method.

: http://publica.fraunhofer.de/documents/N-264402.html