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Transmitter PIC for THz applications based on generic integration technology

 
: Soares, F.M.; Kreissl, J.; Theurer, M.; Bitincka, E.; Goebel, T.; Moehrle, M.; Grote, N.

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Institute of Electrical and Electronics Engineers -IEEE-:
25th International Conference on Indium Phosphide and Related Materials, IPRM 2013. Proceedings : Held 19-23 May 2013, Kobe, Japan
Piscataway/NJ: IEEE, 2013
ISBN: 978-1-4673-6130-9 (Print)
ISBN: 978-1-4673-6131-6 (Online)
ISBN: 978-1-4673-6132-3
2 pp.
International Conference on Indium Phosphide and Related Materials (IPRM) <25, 2013, Kobe>
English
Conference Paper
Fraunhofer HHI ()

Abstract
A generic InP based monolithic photonic integration platform is introduced that is capable of simultaneously incorporating transmitter, receiver and passive-optical functionalities. On this basis, an integrated transmitter component for THz applications has been implemented.

: http://publica.fraunhofer.de/documents/N-264379.html