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Reliability of power semiconductor modules combining active and passive temperature cycling

 
: Goehre, J.; Schmitz, S.; Schneider-Ramelow, M.; Lang, K.-D.

MESAGO PCIM GmbH, Stuttgart:
PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. CD-ROM : Nuremberg, 8 - 10 May 2012. Proceedings
Berlin: VDE-Verlag, 2012
ISBN: 978-3-8007-3431-3
pp.1611-1613
PCIM Europe <2012, Nürnberg>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The reliability of power semiconductor modules is typically determined by separate active or passive temperature cycling. However, interdependences of the single failure mechanisms cannot be captured this way. In this paper a new testing method combining active and passive temperature cycling is introduced. First results of combined testing are presented.

: http://publica.fraunhofer.de/documents/N-263907.html