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High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing

 
: Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.

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Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International 3D Systems Integration Conference, 3DIC 2011 : Osaka, Japan, 31 January - 2 February 2012 (postponed from October 2011)
Piscataway, NJ: IEEE, 2012
ISBN: 978-1-4673-2189-1
pp.202-205
International 3D Systems Integration Conference (3DIC) <2011, Osaka>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Most advanced IC devices including packaging and substrates are requiring smart solution for wafer thinning/handling as well as stacking techniques to enhance performance and/or achieving ultimate assembling density. However existence thinning and handling technique or materials are facing difficulties in case of stand under high temperature or aggressive chemicals during processing e.g. via formation, insulation, via filling and stacking for 3D-assembling. In stead of them, an idea is applying high temperature and chemical resistant polyimide base temporary / permanent bonding adhesives to the series of process for eliminating difficulties.

: http://publica.fraunhofer.de/documents/N-263804.html