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TSV modeling considering signal integrity issues

 
: Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D.

International Microelectronics and Packaging Society -IMAPS-:
43rd International Symposium on Microelectronics, IMAPS 2010 : Raleigh, North Carolina, USA, 31 October - 4 November
Red Hook, NY: Curran, 2011
ISBN: 978-1-617-82320-6
pp.572-576
International Symposium on Microelectronics (IMAPS) <43, 2010, Raleigh/NC>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Since a TSV has a metal-insulator-semiconductor structure, it supports three fundamental modes namely, skineffect, slow-wave and dielectric quasi-TEM mode. In this contribution, we predict the frequency range of these modes, considering TSVs for interposer applications as an example. Furthermore, the impact of Si-resistivity on signal integrity is quantified and coaxial TSV configurations are proposed to minimize this impact.

: http://publica.fraunhofer.de/documents/N-263614.html