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A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications

 
: Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.

IMAPS 2009, 42nd International Symposium on Microelectronics : Bringing Together The Entire Microelectronics Supply Chain! November 1-5, 2009 San Jose Convention Center - San Jose, California, USA
San Jose, Calif., 2009
ISBN: 0-930815-89-0
pp.1078-1083
International Symposium on Microelectronics <42, 2009, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper presents a comparative study of the losses of 4 commonly used planar transmission lines (microstrip, coplanar, grounded coplanar and stripline). The losses are separated into conductor dielectric and radiation losses and investigated on 3 different technologies. These technologies are thin-film polymer substrate, low cost printed circuit board and glass. The attenuation on these 4 lines is computed using quasi-static methods and full wave simulations. The goal is to get an insight on the different frequency-dependent behaviour of the lines to provide the optimal line configuration for a given substrate technology and frequency region.

: http://publica.fraunhofer.de/documents/N-263505.html