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3D integration technologies for miniaturized tire pressure monitor system (TPMS)

 
: Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.

International Microelectronics and Packaging Society -IMAPS-:
International Conference and Exhibition on Device Packaging 2009 : Scottsdale/Fountain Hills, Arizona, USA, 9 - 12 March 2009
2009
ISBN: 978-1-615-67325-4
pp.296-322
International Conference and Exhibition on Device Packaging <5, 2009, Scottsdale>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-263359.html