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Development of quasi-passive optical substrates for photonic packaging

 
: Li, B.; Menger, J.; Walsh, T.; Wirz, H.; Sharon, A.

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MEMS 2005 Miami, 18th IEEE International Conference on Micro Electro Mechanical Systems. Technical Digest
Piscataway: IEEE Operations Center, 2005
ISBN: 0-7803-8732-5
pp.104-107
IEEE International Conference on Micro Electro Mechanical Systems (MEMS) <18, 2005, Miami>
English
Conference Paper
Fraunhofer CMI ()

Abstract
While the silicon micro-bench with purely passive locational features was an attempt at PCB-like integration for photonic applications, it failed to provide the high tolerance alignment required for efficient light coupling between devices and/or fibers. To optimize the final alignment without the introduction of on-board active actuators or external high-precision manipulators, we have developed and demonstrated a low-cost, micro-machined optical bench with quasi-passive locational features capable of sub-micron alignment optimization. The concept capitalizes on inherent residual tensile stresses produced during the stoichiometric Si 3N 4 thin-film deposition process. By selectively trimming stress element on either side of a suspended platform, the equilibrium position can be biased to one side or another, enabling high resolution relative motion between the suspended platform and the base. We have demonstrated, as a first attempt, high-efficiency fiber-to-fiber align ment using this concept.

: http://publica.fraunhofer.de/documents/N-263041.html