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2012
Conference Paper
Titel
Integrated nano scale multilayer systems for reactive bonding in microsystems technology
Abstract
This paper is presenting a metallic wafer bond process at room-temperature by using nano scale and integrated Pd/Al reactive multilayer systems. These systems are used as controllable and internal heat sources. By controlling the reaction properties of the systems strong and high yield wafer bonding of Si-Si, Si-glass as well as Si-ceramic without any significant defects is possible.