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3D micro-optical lens scanner made by multi-wafer bonding technology

 
: Bargiel, S.; Gorecki, C.; Baranski, M.; Passilly, N.; Wiemer, M.; Jia, C.; Frömel, J.

:

Piyawattanametha, W. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
MOEMS and Miniaturized Systems XII : 2.-7.2.2013, San Francisco, CA, USA
Bellingham, WA: SPIE, 2013 (Proceedings of SPIE 8616)
ISBN: 978-0-8194-9385-9
Paper 861605
Conference "MOEMS and Miniaturized Systems" <12, 2013, San Francisco/Calif.>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
We present the preliminary design, construction and technology of a microoptical, millimeter-size 3-D microlens scanner, which is a key-component for a number of optical on-chip microscopes with emphasis on the architecture of confocal microscope. The construction of the device relies on the vertical integration of micromachined building blocks: top glass lid, silicon electrostatic comb-drive X-Y and Z microactuators with integrated scanning microlenses, ceramic LTCC spacer, and bottom lid with focusing microlens. All components are connected on the wafer level only by sequential anodic bonding. The technology of through wafer vias is applied to create electrical connections through a stack of wafers. More generally, the presented bonding/connection technologies are also of a great importance for the development of various silicon-based devices based on vertical integration scheme. This approach offers a space-effective integration of complex MOEMS devices and an effect ive integration of various heterogeneous technologies.

: http://publica.fraunhofer.de/documents/N-254764.html