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Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation

: Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. Vol.1 : San Diego, California, USA, 30 May - 1 June 2012
New York, NY: IEEE, 2012
ISBN: 978-1-4244-9533-7 (Print)
ISBN: 978-1-4244-9531-3
ISBN: 978-1-4244-9532-0
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <13, 2012, San Diego/Calif.>
Conference Paper
Fraunhofer IZM ()

This paper presents a comprehensive method for obtaining urgently required critical interface delamination data of material pairings used in electronic packaging. The objective is to thereby enable rapid, inexpensive and accurate lifetime prediction for that failure mode. A new testing method is presented which allows maximummode-angle range and enhanced throughput testing under multiple loading conditions, the coverage of which is usually a rather lengthy and resource-demanding procedure. The approach is specimen-centred in the sense that the accent is put on test-specimens which are easily manufacturable industrially, rather than having to adapt them to a special testing machine. The concept is also scalable, i.e. it has potential to work also for smaller samples cut fromreal devices. We show the first version of a newly developed test-stand and discuss the obtained results for copper-molding compound interfaces in the light of the current state of the art used for de lamination testing in electronic packaging.