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Substrateless sensor packaging using wafer level fan-out technology

: Briindel, M.; Scholz, U.; Haag, F.; Graf, E.; Braun, T.; Becker, K.-F.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings : 5 - 7 December 2012, Resort World Sentosa, Singapore
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4553-8 (Print)
ISBN: 978-1-4673-4551-4 (Online)
Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>
Conference Paper
Fraunhofer IZM ()

In this paper, we present the application of a substrateless packaging technology consisting of sub sequential molding of ASIC and MEMS dice und forming redistribution layers (RDL) on the molding compound. Acceleration sensors and pressure sensors were packaged, each sensor type presenting its own challenges. For pressure sensors it is crucial to ensure the access of the surrounding media to the pressure sensitive membrane. This was achieved by structuring the redistribution layer without changing the process, making the application of standard equipment and materials relatively easy. The acceleration sensors needed to be modified by trough silicon vias to fit the packaging process. For the redistribution layer, a novel approach was evaluated in parallel to the standard thin-film technology for the acceleration sensor package. All sensor packages fabricated by the process have been found to be within the specifications of standard packages using the same MEMS dice.