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Pattern-based integrative design of molded interconnect devices (MID)
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2012
Conference Paper
Titel
Pattern-based integrative design of molded interconnect devices (MID)
Author(s)
Dumitrescu, Roman
Gaukstern, Tobias
Jürgenhake, Christoph
Gausemeier, Jürgen
Kühn, Arno
Hauptwerk
Proceedings of DESIGN 2012. Vol.3
Konferenz
International Design Conference (DESIGN) 2012
Language
English
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Fraunhofer-Institut für Produktionstechnologie IPT