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Modeling and optimization of electronic packaging structures for signal and power integrity

 
: Scogna, A.C.; Engin, A.E.; Ndip, I.

DesignCon 2012: Where Chipheads Connect. Vol.4 : 30 January - 2 February 2012, Santa Clara
Red Hook, NY: Curran, 2012
ISBN: 978-1-62276-645-1
pp.2831-2879
DesignCon <2012, Santa Clara>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Goal of this workshop is to provide modeling and design guidelines to signal integrity (SI) engineers, who are daily dealing with the design of high performance communication electronic circuits, multilayer PCBs and/or packages. Transmission line theory is revisited in order to take into account important phenomena like surface roughness, glass weave effect and proper material models. Modeling of discontinuities (both planar and vertical) is deeply discussed (by means of multiple numerical methods) along with possible solutions to mitigate their effect and improve the SI. Alternative design solutions to eliminate the mode guided between two ground planes (referred as ground-ground mode) which is the main cause of noise in multilayered structures (both PCBs and packages) are presented. Model to hardware correlation is used not only to verify the validity of the proposed numerical models, but to also provide a checklist that every SI engineer (even if not EM expert) can u se to achieve such validity in their models.

: http://publica.fraunhofer.de/documents/N-254104.html