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Modelling and characterisation of smart power devices

: Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.

Institute of Electrical and Electronics Engineers -IEEE-:
18th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2012 : 25-27 September 2012, Budapest, Hungary
Grenoble: EDA Publishing, 2012
ISBN: 978-2-35500-022-5
ISBN: 978-1-4673-1882-2
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <18, 2012, Budapest>
Conference Paper
Fraunhofer IZM ()
Fraunhofer ENAS ()

This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation, thus turning it into a smart power device. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. This paper is the first in a series of planned publications on the ongoing work in the project.